ADC DSX4H-3H-ICM Cross Reduced Connect DS3

( Brand: Adc ), ( Manufacturer Part Number: DSX4H-3H-ICM )

Review ADC Cross Reduced Connect Ds3

The DSX4H-3H-ICM Cross Reduced Connect ADC DS3 is a high-performance, versatile network interface card (NIC) designed for data center applications. This device is a part of the DS-Series family, known for their reliability and efficiency in handling high-speed data communication.

The DSX4H-3H-ICM NIC features 4 High-Speed SerDes interfaces, each capable of supporting speeds up to 3.2 Gbps, making it an ideal choice for applications that require high data throughput. The device also includes 3 High-Speed I/O Controller Hub (ICH) interfaces, which provide additional connectivity options.

The Cross Reduced Connect feature allows for the simultaneous use of both High-Speed SerDes and High-Speed ICH interfaces, providing flexibility in network design and configuration. The ADC DS3 (Annex D3) compliance ensures compatibility with various types of SDH/SONET networks, making it suitable for a wide range of telecommunication applications.

The DSX4H-3H-ICM NIC is designed with reliability in mind, featuring advanced error correction and forward error correction techniques to ensure data integrity. It also supports hot plug-and-play capabilities, allowing for easy installation and maintenance without the need to shut down the system.

In summary, the DSX4H-3H-ICM Cross Reduced Connect ADC DS3 is a powerful and versatile NIC that offers high-speed data communication, flexibility in network design, and reliability in data transmission. It is an excellent choice for data center applications that require high-speed data throughput and compatibility with various types of SDH/SONET networks.

The DSX4H-3H-ICM Cross Reduced Connect ADC DS3 is a high-density interconnect (HDI) technology used in PCB design. Here are some pros and cons of using this technology:

1. Increased density: The DSX4H-3H-ICM technology allows for a higher number of components to be placed on a smaller area of the PCB, leading to reduced board size and weight.

2. Improved signal integrity: The reduced via pitch and reduced trace widths in DSX4H-3H-ICM technology can help improve signal integrity by reducing signal skew and crosstalk.

3. Cost savings: By reducing the size of the PCB, the material and manufacturing costs can be lower, leading to potential cost savings.

1. Complexity: The DSX4H-3H-ICM technology is more complex to design and manufacture than traditional PCB technologies, which can increase the time and cost of the design and manufacturing process.

2. Limited component availability: Some components may not be available in the smaller package sizes required for DSX4H-3H-ICM technology, which can limit design options.

3. Increased risk of reliability issues: The smaller via sizes and trace widths in DSX4H-3H-ICM technology can increase the risk of reliability issues such as solder joint failure, via failure, and trace cracking.

DSX4H-3H-ICM technology can offer significant benefits in terms of increased density, improved signal integrity, and potential cost savings. However, the complexity and potential reliability issues associated with this technology should be carefully considered before making a decision to use it. It may be appropriate to use DSX4H-3H-ICM technology in applications where the benefits outweigh the drawbacks and where the increased complexity and potential reliability issues can be mitigated through careful design and manufacturing practices.

If you are considering using DSX4H-3H-ICM technology, it is recommended to work with an experienced PCB designer and manufacturer who has experience in designing and manufacturing HDI PCBs. Additionally, it is important to conduct reliability testing to ensure that the design meets the required reliability standards. It is also recommended to carefully evaluate the cost-benefit analysis to determine if the potential benefits of using DSX4H-3H-ICM technology outweigh the additional costs and complexity associated with it.

Details:

Adc dsx4h 3h icm ds3 cross connect loaded with 2 Adc dsx 4h MB icm interconnect modules.

part #: dsx4h3h price

• $250.00

specifications rackmountcasee:

• brand: Adc
• mpn: Dsx4h-3h-icm

Ratings:

1. Quick response and fast payment. Perfect! THANKS!! 09-27-16
2. Quick response and fast payment. Perfect! THANKS!! 06-01-16
3. good price, working great 07-12-16
4. Thanks for shopping with Liquid Technology! Follow us on Twitter! liquid8tech 03-09-16
5. Hope to deal with you again. Thank you. 05-05-16

Returns rackmountcasee:

• policy: no returns

Shipping rackmountcasee:

• cost: $0.0
• type: Flat
• handling: 2 days

Payments rackmountcasee:

• PayPal

General rackmountcasee:

• Computers/Tablet's & Networking > Enterprise Networking, Servers > Racks, Chassis & Patch Panels > Other Ent. Networking Racks
• condition: Used
• in stock: Yes

Seller rackmountcasee:

• zipcode: 98501
• city: Olympia, Washington

Offer rackmountcasee:

• # bids: 0
• quantity: 1
• best offer: true
• Started: October 4, 2016, 9:35 am
• # Sold: 0

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